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DX150
    DX150
  • DX150

DX150 Series

Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Thermal Interface Materials

Dynamic Mixing Valve

The DX150 Dynamic Mixing Valve is ideal for difficult to mix, two component materials that have a wide mix ratio, and/or a wide viscosity delta between part A and B. It can also be used in applications where space is limited and a long static mixer cannot be used.

The DX150 can be used in both manual and automated meter mix processes.

The DX150 has many additional integrated features including:

  • Servo driven dynamic mixer for accurate mixing speeds and process control
  • Stainless steel wetted parts and valve body
  • Divorced design prevents fluid from contaminating the valve actuators
  • Separate material paths prevent mixing prior to leaving the valve body
  • High pressure capability allows processing of medium viscosity materials
  • Compact design for easy manual or automated integration

Resources

Datasheets

Brochures

Applications

Dispensing

Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Dispensing Details

Encapsulation & Glob Top

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

Encapsulation & Glob Top Details

Gasketing

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other design.

Gasketing Details

Potting

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

Potting Details

Thermal Interface Materials

A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

Thermal Interface Materials Details