What is Encapsulation?

Encapsulation involves covering an electronic assembly or component with a compound to protect the device from mechanical stress, moisture, corrosion, and foreign debris.

When to Use Encapsulation

Encapsulation is used to apply an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. The encapsulation process provides components with shock and heat resistance for harsh environments leading to longer product reliability. Encapsulation can be very similar to potting, however is utilized to protect a device without the presence of a case or frame.

Benefits of Encapsulation

  • Increased component longevity
  • Heat and shock resistance
  • Moisture and corrosion resistance
  • Withstand harsh environments
  • Thick and more robust solution
  • Use without the need for a case or frame

Recommended Encapsulation Valves

PVA offers a wide variety of valves ideal for your encapsulation process.

SVX

Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Staking, Surface Mount Adhesive / Solder Paste
FCM100 Non-Contact Micro Dispensing Valve

FCM100

Conformal Coating, Encapsulation & Glob Top

SV200

Bonding, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Surface Mount Adhesive / Solder Paste

Sample Encapsulation Line

Pathmaster X displayed on Delta 8 screen

Delta 8

Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Masking, Potting, Staking, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill
FCM100 Non-Contact Micro Dispensing Valve

FCM100

Conformal Coating, Encapsulation & Glob Top
Spectra UV Curing Oven

Spectra

Conformal Coating, Dispensing, Masking

Questions about encapsulation?

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Encapsulation Videos