SD100
Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Staking, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill
Thermal Interface Material (TIM) can be used to fill nano-sized imperfections caused by machining processes. Left untreated, these gaps can decrease thermal conductivity between two surfaces when only air is present. A variety of dispensable liquid TIMs exist for aiding with heat transfer and relieving stress caused by coefficient of thermal expansion (CTE) mismatch. Thermal grease, gap fillers, dispensable “gels,” and conductive potting are the most common forms of this technology. Thermal grease and semi-adhesive TIMs improve the reliability of integrated components and heat sinks.
Thermal Interface Materials are used to improve distribution of heat between integrated components and heat dissipating devices. The primary considerations when selecting a TIM are thermal conductivity and dielectric strength, but other features must be considered to establish a proper dispensing process such as viscosity, filler density, filler particle size, curing mechanism, and chemistry.
PVA offers a range of thermal interface material equipment including the valves below.