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Flex Cell Custom Selective Coating/Dispensing System
    Flex Cell Custom Selective Coating/Dispensing System
  • Flex Cell Custom Selective Coating/Dispensing System
  • Flex Cell Custom Selective Coating/Dispensing System
  • Flex Cell Custom Selective Coating/Dispensing System

Flex Cell

Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill

Custom Selective Coating/Dispensing System

The Flex Cell is a custom three or four-axis robotic platform for dispensing a wide variety of adhesives, sealants, and conformal coatings. Each Flex Cell is designed to your specific application and with your desired options.

The Flex Cell employs a robust gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback for a truly closed-loop process.

The Flex Cell has many options and integrated features including:

  • Robotic system repeatability of 25 microns
  • Patented servo-controlled optional four-axis motion featuring valve tilt and rotate
  • Closed loop process control throughout gantry system
  • Multiple dispensing applications or materials in one cell
  • Onboard PC for unlimited program storage
  • Exclusive PathMaster® programming environment

 

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Applications

Conformal Coating

The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.

Conformal Coating Details

Dam & Fill

A two-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead depending on the target fill height required.

Dam & Fill Details

Dispensing

Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Dispensing Details

Encapsulation & Glob Top

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

Encapsulation & Glob Top Details

Gasketing

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other design.

Gasketing Details

Potting

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

Potting Details

Surface Mount Adhesive / Solder Paste

Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface. Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.

Surface Mount Adhesive / Solder Paste Details

Thermal Interface Materials

A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

Thermal Interface Materials Details

Underfill

The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.

Underfill Details