Back to all products
  • 3D Rendering

PVA350

Conformal Coating, Dam & Fill, Dispensing, Encapsulation & Glob Top, Gasketing, Potting, Surface Mount Adhesive / Solder Paste, Thermal Interface Materials, Underfill

Benchtop Coating/Dispensing System

The PVA350 is a flexible three or four-axis robot that is suitable for virtually any benchtop of laboratory selective coating and automated dispensing application. The PVA350 features a robust overhead motion platform employing brushless DC servo motors and precision ball screw slides. Encoder feedback on all axes assures a closed-loop process that is consistent and reliable. The PVA350 platform is enclosed for added protection during spray applications.

The PVA350 has many options and integrated features including:

  • A compact, tabletop design that favors portability
  • Large work area
  • Optional four-axis tilt and rotation motion
  • Optical encoder feedback on all axes of motion
  • Coordinated motion in all axes simultaneously
  • RS232 communication port
  • Front panel LCD screen and remote trackball teach pendant
  • Exclusive PathMaster® programming environment

Resources

Product Manuals

Datasheets

Brochures

Applications

Conformal Coating

The application of a protective film or layer of liquid onto a PCB, either in selected areas or over the entire assembly. Conformal coatings are applied using an array of technologies such as atomized spray, airless film, needle dispense and jetting.

Conformal Coating Details

Dam & Fill

A two-step process of first dispensing a high viscosity fluid around the perimeter of a device or electronic circuitry, and then dispensing a low viscosity fluid within the perimeter to fully encase the components. The dam can be applied as a single or multi-layer bead depending on the target fill height required.

Dam & Fill Details

Dispensing

Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.  PVA's award winning valves and pumps are available to dispense a broad spectrum of chemistries to meet the requirements of your most demanding applications.

Dispensing Details

Encapsulation & Glob Top

Applying an epoxy or silicone-based fluid that completely covers a defined area around a flip chip or wire bonded component. This provides mechanical shock and vibration stability, as well as environmental protection from moisture and foreign objects.

Encapsulation & Glob Top Details

Gasketing

Also known as "form-in-place gasketing," this application dispenses one or two-part liquids into a groove or onto a flange that will cure to form a seal against liquids and gases. This automated process eliminates the task of assembling a die cut or pre-made gasket. Additionally, geometries can easily be modified for other design.

Gasketing Details

Potting

The process of filling an enclosure that holds electronic circuitry, with a liquid that when cured completely encases the unit. This provides mechanical stability during shock and vibration as well as environmental protection from moisture and foreign objects.

Potting Details

Surface Mount Adhesive / Solder Paste

Surface Mount Adhesive (SMA), solder paste, and filled epoxies require accurate deposits to adhere SMT components to a PCB surface. Consistent dot or bead profiles are critical for bonding a broad range of components with a growing emphasis on miniaturization that is achievable with jetting valves or auger pumps.

Surface Mount Adhesive / Solder Paste Details

Thermal Interface Materials

A thermal interface material (“TIM”) fills gaps between mating surfaces with a substance that improves thermal conductivity beyond the air that would have otherwise filled that gap. The TIM acts as a conductive bridge that greatly improves heat transfer between between a heat-generating device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

Thermal Interface Materials Details

Underfill

The application of a fluid along one or more edges of an electronic component, such as a flip chip or BGA type package, that flows underneath using capillary action. Underfill is used to prevent thermal mismatch between the component and the substrate, prevent moisture penetration, and to provide mechanical stability during shock and vibration.

Underfill Details